Emitter array with shared via to an ohmic metal shared between adjacent emitters

ABSTRACT

An emitter array may comprise a plurality of emitters that includes two adjacent emitters. The emitter array may comprise a plurality of emitters that includes two adjacent emitters. The ohmic metal layer may include a portion that is shared by, and located between, the two adjacent emitters. The emitter array may comprise a protective layer over the ohmic metal layer. The emitter array may comprise a via through the protective layer to the portion. The via is shared by, and located between, the two adjacent emitters.

RELATED APPLICATION

This application claims priority under 35 U.S.C. § 119 to U.S.Provisional Patent Application No. 62/649,366, filed on Mar. 28, 2018,the content of which is incorporated by reference herein in itsentirety.

TECHNICAL FIELD

The present disclosure relates to an emitter array and, moreparticularly, to an emitter array with shared via to an ohmic metalshared between adjacent emitters.

BACKGROUND

An emitter can include a vertical-emitting device, such as a verticalcavity surface emitting laser (VCSEL). A VCSEL is a laser in which abeam is emitted in a direction perpendicular to a surface of the VCSEL(e.g., vertically from a surface of the VCSEL). Multiple emitters may bearranged in an emitter array with a common substrate.

SUMMARY

According to some implementations, a vertical cavity surface emittinglaser (VCSEL) array, may comprise: a plurality of VCSELs including twoadjacent VCSELs; an ohmic metal layer associated with the plurality ofVCSELs; and a protective layer over the ohmic metal layer, wherein theprotective layer includes a via to the ohmic metal layer, wherein thevia is shared between the two adjacent VCSELs of the plurality ofVCSELs.

According to some implementations, an emitter array, may comprise: aplurality of emitters that includes two adjacent emitters; an ohmicmetal layer associated with the plurality of emitters, wherein the ohmicmetal layer includes a portion that is shared by, and located between,the two adjacent emitters; a protective layer over the ohmic metallayer; and a via through the protective layer to the portion, whereinthe via is shared by, and located between, the two adjacent emitters.

According to some implementations, a method of forming a laser array maycomprise: forming two adjacent lasers on or within a substrate; forming,in association with forming the two adjacent lasers, an ohmic metallayer including forming a portion of the ohmic metal layer shared by,and in a location between, the two adjacent lasers; forming, inassociation with forming the ohmic metal layer, a protective layer overthe laser array; and forming, in association with forming the ohmicmetal layer, a via through the protective layer to the ohmic metallayer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B are diagrams depicting a top-view of an examplevertical-emitting device and a cross-sectional view of the examplevertical-emitting device, respectively.

FIG. 1C depicts a prior configuration of emitters of an emitter array.

FIGS. 2A and 2B are diagrams of one or more example implementationsdescribed herein.

FIGS. 3A and 3B are diagrams depicting a top-view of another exampleimplementation and cross-sectional views of that example implementation,respectively.

FIG. 4 is a flow chart of an example process for forming an emitterarray with shared via to an ohmic metal shared between adjacentemitters.

DETAILED DESCRIPTION

The following detailed description of example implementations refers tothe accompanying drawings. The same reference numbers in differentdrawings may identify the same or similar elements.

Emitter arrays are used in various applications. For example, emitterarrays are used in three-dimensional sensing applications, such asstructured light applications, time-of-flight applications, lightdetection and ranging (LIDAR) applications, and/or the like. An emitterarray includes multiple emitters, such as multiple verticallight-emitting devices formed on a chip which is in turn formed on awafer. Typically, an emitter includes a mesa structure that includes anohmic metal layer around an aperture of the emitter (e.g., in a ring orpartial ring shape) and a set of vias through protective layers down tothe ohmic metal layer (e.g., also in a ring or partial ring shape thatmatches the shape of the ohmic metal layer). In addition, the emitterarray includes trenches between the mesa structure of the emitter (andin some cases that form the mesa structure) and one or more otheremitters of the emitter array. For example, the trenches are oftenformed around the ohmic metal layer and/or the corresponding set of viasof the emitter. This configuration of an emitter and/or an emitter array(e.g., where a trench is formed around the ohmic metal layer and thecorresponding set of vias) often results in narrow manufacturingtolerances and/or often requires a particular amount of chip space foreach emitter of an emitter array. The more closely that the emitters ofan emitter array can be spaced, the more the overall chip size can bereduced. Small chip sizes allow more chips per wafer and smaller chipscan be placed in smaller packages, thereby reducing the overall cost ofthe chip and package.

Some implementations described herein provide an emitter array that isconfigured with multiple emitters where a via to an ohmic metal layer isshared between adjacent emitters. For example, the via may be in aninterstitial area between (or adjacent to) two emitters and may beassociated with a portion of an ohmic metal layer that is also sharedbetween (or adjacent to) the two emitters, such that the portion of theohmic metal layer electrically connects to each of the adjacentemitters. For example, the via may extend through a protective layer ofthe emitter array to the portion of the ohmic metal layer so that thevia is shared between the two emitters. In this way, two adjacentemitters of an emitter array may share an ohmic metal layer and/or a viaassociated with the ohmic metal layer based on a portion of the ohmicmetal layer and/or the via being located between the two adjacentemitters, rather than the two adjacent emitters including isolated viasin or on their respective mesa structures.

This configuration facilitates a reduction in an area of an ohmic metallayer and/or a via relative to previous configurations, therebyconserving space associated with the emitter array and increasingdensity of emitters per chip. In addition, this configurationfacilitates smaller sized emitters (e.g., with smaller diameters)relative to previous configurations of emitters, thereby facilitating areduction in a distance between emitters of the emitter array (e.g.,emitter arrays with smaller pitch between emitters), a reduction in anoverall chip size associated with the emitter array (e.g., smallersquare area for the same number of emitters as prior designs), anincrease in a quantity of emitters that can be included on a chip of aparticular size (with particular dimensions compared to prior designs),and/or the like. In some applications, such as a three-dimensionalsensing application, increasing a quantity of emitters in an emitterarray on a chip of a particular size may improve operation of a devicethat uses the emitter array by providing the device with a higherquantity of points of light to use for three-dimensional sensing and/orby providing greater power or brightness from a chip of that particularsize. Further, reducing a size of emitters on a chip, without increasinga quantity of emitters on the chip, provides wider manufacturingtolerances relative to previous designs of emitter arrays, therebyfacilitating faster manufacturing of an emitter array, reduced costs ofmanufacturing an emitter array, a reduction in defects duringmanufacturing of an emitter array, a reduction in post-manufacturingdefects from propagation of dislocations (e.g., the smaller emittersize, while maintaining a chip size, results in more distance betweenemitters, which may reduce a likelihood of a dislocation intersecting anemitter), and/or the like.

FIGS. 1A and 1B are diagrams depicting a top-view of an example emitter100 and a cross-sectional view 150 of example emitter 100 along the lineX-X, respectively. As shown in FIG. 1A, emitter 100 may include a set ofemitter layers constructed in an emitter architecture. In someimplementations, emitter 100 may correspond to one or morevertical-emitting devices described herein.

As shown in FIG. 1A, emitter 100 may include an implant protection layer102 that is circular in shape in this example. In some implementations,implant protection layer 102 may have another shape, such as anelliptical shape, a polygonal shape, or the like. Implant protectionlayer 102 is defined based on a space between sections of implantmaterial (not shown) included in emitter 100.

As shown by the medium gray and dark gray areas in FIG. 1A, emitter 100includes an ohmic metal layer 104 (e.g., a P-Ohmic metal layer or anN-Ohmic metal layer) that is constructed in a partial ring-shape (e.g.,with an inner radius and an outer radius). The medium gray area shows anarea of ohmic metal layer 104 covered by a protective layer (e.g. adielectric layer, a passivation layer, and/or the like) of emitter 100and the dark gray area shows an area of ohmic metal layer 104 exposed byvia 106, described below. As shown, ohmic metal layer 104 overlaps withimplant protection layer 102. Such a configuration may be used, forexample, in the case of a P-up/top-emitting emitter 100. In the case ofa bottom-emitting emitter 100, the configuration may be adjusted asneeded.

Not shown in FIG. 1A, emitter 100 includes a protective layer in whichvia 106 is formed (e.g., etched). The dark gray area shows an area ofohmic metal layer 104 that is exposed by via 106 (e.g., the shape of thedark gray area may be a result of the shape of via 106) while the mediumgrey area shows an area of ohmic metal layer 104 that is covered by someprotective layer. The protective layer may cover all of the emitterother than the vias. As shown, via 106 is formed in a partial ring-shape(e.g., similar to ohmic metal layer 104) and is formed over ohmic metallayer 104 such that metallization on the protection layer contacts ohmicmetal layer 104. In some implementations, via 106 and/or ohmic metallayer 104 may be formed in another shape, such as a full ring-shape or asplit ring-shape.

As further shown, emitter 100 includes an optical aperture 108 in aportion of emitter 100 within the inner radius of the partial ring-shapeof ohmic metal layer 104. Emitter 100 emits a laser beam via opticalaperture 108. As further shown, emitter 100 also includes a currentconfinement aperture 110 (e.g., an oxide aperture formed by an oxidationlayer of emitter 100 (not shown)). Current confinement aperture 110 isformed below optical aperture 108.

As further shown in FIG. 1A, emitter 100 includes a set of trenches 112(e.g., oxidation trenches) that are spaced (e.g., equally, unequally)around a circumference of implant protection layer 102. How closelytrenches 112 can be positioned relative to the optical aperture 108 isdependent on the application, and is typically limited by implantprotection layer 102, ohmic metal layer 104, via 106, and manufacturingtolerances.

The number and arrangement of layers shown in FIG. 1A are provided as anexample. In practice, emitter 100 may include additional layers, fewerlayers, different layers, or differently arranged layers than thoseshown in FIG. 1A. For example, while emitter 100 includes a set of sixtrenches 112, in practice, other configurations are possible, such as acompact emitter that includes five trenches 112, seven trenches 112,and/or the like. In some implementations, trench 112 may encircleemitter 100 to form a mesa structure d_(t). As another example, whileemitter 100 is a circular emitter design, in practice, other designs maybe used, such as a rectangular emitter, a hexagonal emitter, anelliptical emitter, or the like. Additionally, or alternatively, a setof layers (e.g., one or more layers) of emitter 100 may perform one ormore functions described as being performed by another set of layers ofemitter 100, respectively.

Notably, while the design of emitter 100 is described as including aVCSEL, other implementations are possible. For example, the design ofemitter 100 may apply in the context of another type of optical device,such as a light emitting diode (LED), or another type of verticalemitting (e.g., top emitting or bottom emitting) optical device.Additionally, the design of emitter 100 may apply to emitters of anywavelength, power level, emission profile, and/or the like. In otherwords, emitter 100 is not particular to an emitter with a givenperformance characteristic.

As shown in FIG. 1B, the example cross-sectional view may represent across-section of emitter 100 that passes through, or between, a pair oftrenches 112 (e.g., as shown by the line labeled “X-X” in FIG. 1A). Asshown, emitter 100 may include a backside cathode layer 128, a substratelayer 126, a bottom mirror 124, an active region 122, an oxidation layer120, a top mirror 118, an implant isolation material 116, a protectivelayer 114 (e.g. a dielectric passivation/mirror layer), and an ohmicmetal layer 104. As shown, emitter 100 may have, for example, a totalheight that is approximately 10 μm.

Backside cathode layer 128 may include a layer that makes electricalcontact with substrate layer 126. For example, backside cathode layer128 may include an annealed metallization layer, such as an AuGeNilayer, a PdGeAu layer, or the like.

Substrate layer 126 may include a base substrate layer upon whichepitaxial layers are grown. For example, substrate layer 126 may includea semiconductor layer, such as a GaAs layer, an InP layer, and/or thelike.

Bottom mirror 124 may include a bottom reflector layer of emitter 100.For example, bottom mirror 124 may include a distributed Bragg reflector(DBR).

Active region 122 may include a layer that confines electrons anddefines an emission wavelength of emitter 100. For example, activeregion 122 may be a quantum well.

Oxidation layer 120 may include an oxide layer that provides optical andelectrical confinement of emitter 100. In some implementations,oxidation layer 120 may be formed as a result of wet oxidation of anepitaxial layer. For example, oxidation layer 120 may be an Al₂O₃ layerformed as a result of oxidation of an AlAs or AlGaAs layer. Trenches 112may include openings that allow oxygen (e.g., dry oxygen, wet oxygen) toaccess the epitaxial layer from which oxidation layer 120 is formed.

Current confinement aperture 110 may include an optically activeaperture defined by oxidation layer 120. A size of current confinementaperture 110 may range, for example, from approximately 4 μm toapproximately 20 μm. In some implementations, a size of currentconfinement aperture 110 may depend on a distance between trenches 112that surround emitter 100. For example, trenches 112 may be etched toexpose the epitaxial layer from which oxidation layer 120 is formed.Here, before protective layer 114 is formed (e.g., deposited), oxidationof the epitaxial layer may occur for a particular distance (e.g.,identified as do in FIG. 1B) toward a center of emitter 100, therebyforming oxidation layer 120 and current confinement aperture 110. Insome implementations, current confinement aperture 110 may include anoxide aperture. Additionally, or alternatively, current confinementaperture 110 may include an aperture associated with another type ofcurrent confinement technique, such as an etched mesa, a region withoution implantation, lithographically defined intra-cavity mesa andregrowth, or the like.

Top mirror 118 may include a top reflector layer of emitter 100. Forexample, top mirror 118 may include a DBR.

Implant isolation material 116 may include a material that provideselectrical isolation. For example, implant isolation material 116 mayinclude an ion implanted material, such as a hydrogen/proton implantedmaterial or a similar implanted element to reduce conductivity. In someimplementations, implant isolation material 116 may define implantprotection layer 102.

Protective layer 114 may include a layer that acts as a protectivepassivation layer and which may act as an additional DBR. For example,protective layer 114 may include one or more sub-layers (e.g., adielectric passivation layer and/or a mirror layer, a SiO₂ layer, aSi₃N₄ layer, an Al₂O₃ layer, or other layers) deposited (e.g., bychemical vapor deposition, atomic layer deposition, or other techniques)on one or more other layers of emitter 100.

As shown, protective layer 114 may include one or more vias 106 thatprovide electrical access to ohmic metal layer 104. For example, via 106may be formed as an etched portion of protective layer 114 or alifted-off section of protective layer 114. Optical aperture 108 mayinclude a portion of protective layer 114 over current confinementaperture 110 through which light may be emitted.

Ohmic metal layer 104 may include a layer that makes electrical contactthrough which electrical current may flow. For example, ohmic metallayer 104 may include a Ti and Au layer, a Ti and Pt layer and/or an Aulayer, or the like, through which electrical current may flow (e.g.,through a bondpad (not shown) that contacts ohmic metal layer 104through via 106). Ohmic metal layer 104 may be P-ohmic, N-ohmic, orother forms known in the art. Selection of a particular type of ohmicmetal layer 104 may depend on the architecture of the emitters and iswell within the knowledge of a person skilled in the art. Ohmic metallayer 104 may provide ohmic contact between a metal and a semiconductorand/or may provide a non-rectifying electrical junction and/or mayprovide a low-resistance contact. In some implementations, emitter 100may be manufactured using a series of steps. For example, bottom mirror124, active region 122, oxidation layer 120, and top mirror 118 may beepitaxially grown on substrate layer 126, after which ohmic metal layer104 may be deposited on top mirror 118. Next, trenches 112 may be etchedto expose oxidation layer 120 for oxidation. Implant isolation material116 may be created via ion implantation, after which protective layer114 may be deposited. Via 106 may be etched in protective layer 114(e.g., to expose ohmic metal layer 104 for contact). Plating, seeding,and etching may be performed, after which substrate layer 126 may bethinned and/or lapped to a target thickness. Finally, backside cathodelayer 128 may be deposited on a bottom side of substrate layer 126.

The number, arrangement, thicknesses, order, symmetry, or the like, oflayers shown in FIG. 1B is provided as an example. In practice, emitter100 may include additional layers, fewer layers, different layers,differently constructed layers, or differently arranged layers thanthose shown in FIG. 1B. Additionally, or alternatively, a set of layers(e.g., one or more layers) of emitter 100 may perform one or morefunctions described as being performed by another set of layers ofemitter 100 and any layer may comprise more than one layer.

FIG. 1C depicts a prior configuration of emitters of an emitter array.For example, FIG. 1C shows a portion of an emitter array 130 (asindicated by the dashed lines around emitter array 130). Emitter array130 includes multiple emitters 100 (each comprising a grouping of white,light gray, medium gray, and dark gray layers and/or structures shown inFIG. 1C) arranged in a two-dimensional pattern. For example, emitter 100may be a vertical light-emitting device, such as a light-emitting diode(LED), a vertical-cavity surface-emitting laser (VCSEL), a verticalexternal-cavity surface-emitting laser (VECSEL), and/or the like.

As further shown in FIG. 1C, emitter array 130 may include varioustrenches 112 (shown in FIG. 1C as black structures). For example, thevarious trenches 112 may include various oxidation trenches and/or maybe located between emitters 100. Continuing with the previous example,adjacent emitters 100 may have one or more trenches 112 between theadjacent emitters 100. As further shown in FIG. 1C, emitter array 130may include a metallization layer 132 on a surface of emitter array 130(e.g., shown by the thatched patterning in FIG. 1C). For example,metallization layer 132 may include a layer of gold, silver, aluminum,copper, and/or the like. FIG. 1C only shows portions of metallizationlayer 132 between emitters 100 to reveal layers and/or structures ofemitter array 130 and/or emitters 100 for illustrative and/orexplanatory purposes. In practice one or more of the layers and/orstructures of emitter array 130 and/or emitter 100 shown in FIG. 1C maybe covered by metallization layer 132.

As further shown in FIG. 1C, emitter 100 may include an aperture 110,shown as the white structure. In addition, and as further shown in FIG.1C, emitter 100 may include an ohmic metal layer 104. For example, ohmicmetal layer 104 forms a partial ring around aperture 110. In FIG. 1C,one can consider ohmic metal layer 104 as both the dark gray area andmedium gray area with a protective layer (e.g., a dielectric layer)covering ohmic metal layer 104 in the medium gray area and via 106exposing ohmic metal layer 104 in the dark gray area. Typically, theprotective layer covers all of emitter array 130 except for any vias,such as via 106. Alternatively, one can consider the medium gray area asshowing a portion of a protective layer having a via 106 through theprotective layer to expose ohmic metal layer 104 under the protectivelayer.

This configuration of emitter array 130 and/or emitters 100 results in asmaller quantity of emitters 100 for particular dimensions of emitterarray 130 (e.g., reduced emitter density per square centimeter of chip),larger chip sizes, and/or the like relative to implementations describedherein.

FIG. 2A shows an emitter array 202 of an example implementation, whichincludes a different configuration of layers and/or structures thanemitter array 130 described above. For example, emitter array 202includes adjacent emitters 204 and one or more trenches 206 between theadjacent emitters 204. In addition, emitter array 202 may include ametallization layer 208 over emitter array 202. Emitter 204 may includean aperture 210, an ohmic metal layer 212, and various vias 214. Via 214may be shared between adjacent emitters 204. For example, and withregard to sharing, via 214 may be configured with respect to theadjacent emitters 204 such that via 214 is located in an interstitialarea (e.g., between the adjacent emitters 204, between apertures(emitting areas) 210 of adjacent emitters 204, between trenches 206shared by adjacent emitters 204, or an area of emitter array 202 betweenmesa structures of the adjacent emitters 204) and such that electricalcurrent travels through via 214 to the ohmic metal layer 212 (or aportion thereof), where the ohmic metal layer 212 is shared by theadjacent emitters 204 (e.g., a single via 214 facilitates flow ofelectrical current to at least two adjacent emitters 204). Similar toemitter array 130, emitter array 202 may include multiple emitters 204(e.g., arranged in a two-dimensional pattern, or in random or irregularpatterns) and one or more trenches 206 between emitters 204. Portions ofmetallization layer 208 are not shown to reveal a structure and/orlayers of emitters 204 and/or emitter array 202, similar to FIG. 1C).Ohmic metal layer 212 is shown by the combination of medium and darkgray areas in FIG. 2A. Portions of ohmic metal layer 212 are shown anddescribed with respect to separate reference numbers. Emitter 204 and/oremitter array 202 may include one or more other layers and/or structuresnot shown in, or described with regard to, FIG. 2A.

The configuration of emitter array 202 will be described in the contextof three emitters 204 of emitter array 202 (e.g., a first emitter 204associated with aperture 210-1, a second emitter 204 associated withaperture 210-2, and a third emitter 204 associated with aperture 210-3).As shown in FIG. 2A, the first emitter 204 and the second emitter 204may include a portion 216 of ohmic metal layer 212 around correspondingapertures 210 of the first emitter 204 and the second emitter 204. Forexample, portion 216-1 may be a ring-shaped layer around aperture 210-1for the first emitter 204 and portion 216-2 may be a similarly shapedlayer around aperture 210-2 for the second emitter 204. In addition, andas further shown in FIG. 2A, a portion 218-1 of ohmic metal layer 212may electrically connect portion 216-1 around aperture 210-1 and portion216-2 around aperture 210-2. For example, portion 218-1 of ohmic metallayer 212 may extend from portion 216-1 to portion 216-2 betweentrenches 206 that are located between the first emitter 204 and thesecond emitter 204. In this way, the first emitter 204 (and/or aperture210-1) and the second emitter 204 (and/or aperture 210-2) areelectrically connected to each other, share portion 216 (throughportions 218), and share one or more vias 214.

Portion 218-1 of ohmic metal layer 212 may be located radially from anadjacent emitter 204 between trenches 206 (e.g., in an interstitial areabetween the first emitter 204 and the second emitter 204), as shown inFIG. 2A. For example, the first emitter 204 may have a hexagonalarrangement of trenches 206 around the mesa structure of the firstemitter 204, and portion 218-1 may be aligned with the trenches 206.

As further shown in FIG. 2A, via 214-1 may expose a portion of ohmicmetal layer 212 (e.g., the dark gray area). For example, via 214-1 mayextend from a surface of a protective layer (not shown in FIG. 2A) tothe portion of ohmic metal layer 212. Additionally, or alternatively,via 214-1 may extend from the surface of the protective layer to portion216-1 and/or portion 216-2. Although not illustrated in FIG. 2A,metallization layer 208 may extend over the protective layer and intovia 214-1 to connect with portions 218-1, 216-1, and/or 216-2 so thatelectrical current can flow to portions 218-1, 216-1, and/or 216-2. As aresult, and in the context of metallization layer 208, vias 214 extendfrom a bottom surface of metallization layer 208 to a top surface ofohmic metal layer 212 through a protective layer. This is shown in, anddescribed with regard to, the first cross-sectional view along axis A-Ain FIG. 3B. As shown in FIG. 2A, via 214-1 is located radially betweentrenches 206 (e.g., is aligned with trenches 206) in the interstitialarea between the first emitter 204 and the second emitter 204. In someimplementations, via 214-1 may be radially closer to aperture 210-1 or210-2 relative to the trenches 206. For example, a radial distancebetween aperture 210-1 and via 214-1 may be less than a radial distancebetween aperture 210-1 and the trenches 206 between aperture 210-1 andaperture 210-2.

As further shown in FIG. 2A, other pairs of emitters 204 may similarlyinclude portions 216 (e.g., 216-1, 216-2, 216-3) (e.g., around anaperture 210 of each emitter 204 of the pair of emitters 204) andportions 218 (e.g., 218-1 and 218-2) to electrically connect theportions 216. For example, and with regard to the third emitter 204associated with aperture 210-3, the first emitter 204 and the secondemitter 204 may both be electrically connected to the third emitter 204via portions (e.g., portions 216 and 218) of ohmic metal layer 212 in amanner similar to that described above. Continuing with the previousexample, portion 216-1 may be connected to portion 216-3 around aperture210-3 by portion 218-2 in manner similar to that by which portion 216-1is electrically connected to portion 216-2. Based on this, the firstemitter 204 may be included in multiple pairs of adjacent emitters 204(e.g., a first pair that includes the first emitter 204 and the secondemitter 204, and a second pair that includes the first emitter 204 andthe third emitter 204). In this way, the same emitter 204 may be amember of multiple pairs of emitters 204 based on including a radiallyspaced configuration of portions 218 to connect the emitter 204 to otheradjacent emitters 204 and a portion 216 to connect the portions 218 toeach other. Further, this configuration facilitates flow of electricalcurrent to multiple adjacent emitters 204 through via 214. In someimplementations, a single via 214 may be used to provide electricalcurrent to emitter array 202 based on the configuration of portions 216and 218 shown in, and described with respect to, FIG. 2A.

As further shown in FIG. 2A, the ring configuration of portion 216 mayelectrically connect different portions 218 associated with differentpairs of emitters 204 that are adjacent. For example, and with regard tothe first emitter 204, portion 216-1 around aperture 210-1 mayelectrically connect portion 218-1 associated with a first pair ofemitters 204 to portion 218-2 associated with a second pair of emitters204.

In this way, the configuration of emitter array 202 reduces oreliminates a need for some layers and/or structures of emitter 204 to beincluded in a mesa structure of emitter 204. For example, theconfiguration of emitter array 202 described herein facilitates removalof a via from a mesa structure of an emitter 204, may facilitate areduction in a size of a portion of an ohmic metal layer included in amesa structure of an emitter 204, and/or the like. This facilitates asmaller (e.g., smaller diameter) mesa structure for emitters 204relative to emitters 100 of emitter array 130 shown in, and describedwith respect to, FIG. 1C. By facilitating a smaller mesa structure,emitters 204 of emitter array 202 may be spaced closer together thanemitters 100 of emitter array 130 (e.g., emitter array 202 may have areduced emitter to emitter pitch relative to emitter array 130).

FIG. 2B shows a portion of an emitter array 220 of an exampleimplementation. For example, emitter array 220 may include an ohmicmetal layer 212 (shown by the medium and dark gray areas in FIG. 2B)that is configured in a different manner than emitter array 202described above. Similar to emitter array 202, emitter array 220 mayinclude multiple emitters 204 (e.g., arranged in a two-dimensionalpattern) and one or more trenches 206 between emitters 204. In addition,emitter array 220 may include metallization layer 208 (shown in asimilar manner as that shown in FIG. 2A with portions of metallizationlayer 208 not shown to reveal layers and/or structures of emitters 204and/or emitter array 220). Further, emitter 204 of emitter array 220 mayinclude aperture 210, ohmic metal layer 212, and a set of vias 224,similar to vias 214, associated with ohmic metal layer 212 (e.g.,located in an interstitial area between adjacent emitters 204). However,and as will be described below, ohmic metal layer 212, the set of vias224, and/or other layers and/or structures of emitter 204 and/or emitterarray 220 may be configured in a different manner than that describedwith regard to emitter array 202. Emitter 204 and/or emitter array 220may include one or more other layers and/or structures not shown in, ordescribed with regard to, FIG. 2B.

The configuration of emitter array 220 will be described in the contextof three emitters 204 of emitter array 220 (e.g., a fourth emitter 204associated with aperture 210-4, a fifth emitter 204 associated withaperture 210-5, and a sixth emitter 204 associated with aperture 210-6).As shown in FIG. 2B, the fourth emitter 204 associated with aperture210-4 may be associated with a portion 222-1 of ohmic metal layer 212.As shown, portion 222-1 may extend from aperture 210-4 to aperture210-5, in a manner similar to that described above with regard toportions 216 and 218. In this way, portion 222-1 may electricallyconnect the fourth emitter 204 (and/or aperture 210-4) to the fifthemitter 204 (and/or aperture 210-5). As further shown in FIG. 2B, aportion of portion 222-1 of ohmic metal layer 212 may be exposed by avia 224-1. Via 224-1 may be similar to vias 214 described above inconnection with FIG. 2A. For example, via 224 may be located in aninterstitial area (e.g., between adjacent emitters 204 or extendingbetween mesas of adjacent emitters). In addition, via 224 may beassociated with a corresponding portion 222 that electrically connectsadjacent emitters 204 to facilitate flow of electrical current into theadjacent emitters 204. Portion 222-1 and/or via 224-1 may be configuredrelative to other layers and/or structures of emitter array 220 in amanner similar to that described with regard to emitter array 202. Forexample, portion 222-1 may extend radially between trenches 206 fromaperture 210-4 to aperture 210-5, and multiple portions 222 (andcorresponding vias 224) associated with emitter 204 may be in a radiallyspaced configuration around aperture 210 of emitter 204. Additionally,or alternatively, and as another example, via 224-1 may be positionedradially between the same trenches 206 as portion 222-1, may be locatedcloser to aperture 210-4 or aperture 210-5 relative to trenches 206between the fourth emitter 204 and the fifth emitter 204, and/or thelike.

Different from emitters 204 described in connection with emitter array202 of FIG. 2A, emitters 204 of emitter array 220 may not havecorresponding portions similar to portion 216. For example, unlikeemitters 204 of emitter array 202, portions 222 associated with emitters204 of emitter array 220 may be physically isolated from each other(e.g., may not be electrically connected to each other in the ohmicmetal layer 212, or may be separate portions). For example, portion222-1 and portion 222-2 may be electrically isolated from each otherbased on the first emitter 204 not including a portion of ohmic metallayer 212 similar to portion 216 described in connection with FIG. 2A,however, portion 222-1 and portion 222-2 may still be electricallyconnected through metallization layer 208 which connects to them throughvias 224-1 and 224-2 and/or within the mesa of emitters 204.

This configuration of layers and/or structures of emitter 204 and/oremitter array 220 further facilitates a reduction in mesa size ofemitter 204 relative to emitter array 130 and/or emitter array 202. Thisfacilitates a further reduction in emitter-to-emitter distance relativeto emitter array 130 and/or emitter array 202.

In this way, implementations described herein provide emitter array 202and/or emitter array 220 where a via is shared between two adjacentemitters 204. For example, the via may be located in an interstitialarea between a pair of adjacent emitters 204 to facilitate flow ofelectric current to at least a portion (e.g., portion 218 and/or portion222) of ohmic metal layer 212 that electrically connects one emitter 204of the pair of adjacent emitters 204 to another emitter 204 of the pairof emitters 204 where the portion is also located in the interstitialarea. This configuration reduces or eliminates a need for some layersand/or structures to be included in a mesa structure of emitter 204. Forexample, the configuration of emitter array 220 described hereinfacilitates removal of a portion of ohmic metal layer 212 from a mesastructure of an emitter 204, facilitates removal of a via from a mesastructure of an emitter 204, and/or the like. This facilitates a smallermesa size of emitter 204 relative to the configuration of emitter array202, thereby facilitating a reduction in distance between emitters 204of emitter array 202 and/or emitter array 220. The reduction in distancefacilitates use of a smaller chip for emitter array 202 and/or emitterarray 220 than for emitter array 130, which conserves costs and/ormaterials associated with manufacturing emitter array 202 and/or emitterarray 220. In addition, this facilitates including a higher quantity ofemitters 204 on a chip of a particular size, thereby improving autilization of an area of the chip. Further, a reduction in a mesa sizeof emitter 204 facilitates wider manufacturing tolerances with regard tomanufacturing emitter array 202 and/or emitter array 220 relative toemitter array 130.

As indicated above, FIGS. 2A and 2B are provided merely as one or moreexamples. Other examples may differ from what is described with regardto FIGS. 2A and 2B.

FIGS. 3A and 3B are diagrams 300 depicting a top-view of another exampleimplementation and cross-sectional views of that example implementation,respectively. FIG. 3A shows a top-view of a portion of emitter array 220similar to that shown in FIG. 2B described above. Reference number 310shows an axis A-A along which a first cross-sectional view of a portionof emitter array 220 is shown in FIG. 3B. For example, axis A-A extendsfrom aperture X through aperture Y to aperture Z of adjacent emitters.Reference number 320 shows an axis B-B along which a secondcross-sectional view of a portion of emitter array 220 is shown in FIG.3B. For example, axis B-B extends from an interstitial area through afirst trench 206 (reference number not shown), through aperture Y,through a second trench 206 (reference number not shown), and to anotherinterstitial area.

Turning to FIG. 3B, reference number 330 shows the first cross-sectionalview of a portion of emitter array 220 along axis A-A. The firstcross-sectional view shows portions of metallization layer 208 onportions 222 of ohmic metal layer 212. As further shown in the firstcross-sectional view, portions of metallization layer 208 contact theportions 222 through corresponding vias 224. This is shown in the firstcross-sectional view of FIG. 3B by an indent in metallization layer 208where a protective layer 340 is absent. Via 224 may be etched from a topsurface of protective layer 340 down to the top of a portion 222 ofohmic metal layer 212 (reference number for ohmic metal layer 212 notshown). Via 224 may be formed before metallization layer 208 is formed.

In addition, the first cross-sectional view shows other layers and/orstructures of the portion of emitter array 220. For example, the firstcross-sectional view shows protective layer 340, oxidation layer 350,and active layer 360. As illustrated in FIG. 3A, electrical current frommetallization layer 208 would flow through portion 222 of ohmic metallayer 212 in the area between emitters 204, through aperture Y andthrough aperture Z. The electrical current is shared between theseadjacent emitters 204. In some embodiments, an implant isolation layermay be provided beneath portion 222 of ohmic metal layer 212 extendingdown into oxidation layer 350 to assist with sharing of electricalcurrent between adjacent emitters 204.

Reference number 370 shows the second cross-sectional view of a portionof emitter array 220 along axis B-B. The second cross-sectional viewshows portions of metallization layer 208 and portions of one or moretrenches 206. In addition, the second cross-sectional view shows otherlayers and/or structures of the portion of emitter array 220, similar tothat shown, and described, in connection with the first cross-sectionalview.

As indicated above, FIGS. 3A and 3B are provided merely as one or moreexamples. Other examples may differ from what is described with regardto FIGS. 3A and 3B.

FIG. 4 is a flow chart of an example process 400 for forming an emitterarray with shared via to an ohmic metal shared between adjacentemitters. For example, FIG. 4 shows an example process 400 formanufacturing emitter array 202 and/or emitter array 220 describedabove. Notably, while example process 400 is described in the context ofmanufacturing emitter array 202 and/or emitter array 220, theimplementations described with respect to process 400 apply equally toother types of emitter arrays with a shared via to an ohmic metal sharedbetween adjacent emitters.

As shown in FIG. 4, process 400 may include forming two adjacent laserson or within a substrate (block 410). For example, process 400 mayinclude forming a plurality of lasers (e.g., emitters 204 of emitterarray 202 and/or emitter array 220) on or within a substrate. To formthe plurality of lasers, various epitaxial layers may be formed on asubstrate layer (e.g., a gallium arsenide (GaAs) substrate and/or thelike). The plurality of lasers may be formed in a pattern, such as atwo-dimensional pattern (e.g., a grid pattern, a hexagonal pattern, arandom pattern, an irregular pattern, and/or the like).

As further shown in FIG. 4, process 400 may include forming, inassociation with forming the two adjacent lasers, an ohmic metal layerincluding forming a portion of the ohmic metal layer shared by, and in alocation between, the two adjacent lasers (block 420). For example,process 400 may include forming ohmic metal layer 212 of emitter array202 and/or emitter array 220. In some implementations, forming the ohmicmetal layer may include forming portions 218 of emitter array 202 and/orportions 222 of emitter array 220, where portions 218 and/or 222 areshared by, and in a location between, the two adjacent lasers. In someimplementations, the ohmic metal layer may be formed after, or inconjunction with, forming the two adjacent lasers.

In some implementations, process 400 may include forming adjacenttrenches (e.g., trenches 206 of emitter array 202 and/or 220) associatedwith the two adjacent lasers (e.g., between the two adjacent lasers).Etching (e.g., wet etching, dry etching, and/or the like) may be used toform the adjacent trenches.

As further shown in FIG. 4, process 400 may include forming, inassociation with forming the ohmic metal layer, a protective layer overthe laser array (block 430). For example, process 400 may includeforming protective layer 114, 340 over emitter array 202 and/or emitterarray 220 (e.g., over at least metallization layer 208 or over at leastohmic metal layer 212). In some implementations, forming the protectivelayer may include forming the protective layer after, or in conjunctionwith, forming the ohmic metal layer.

As further shown in FIG. 4, process 400 may include forming, inassociation with forming the protective layer, a via through theprotective layer to the ohmic metal layer (block 440). For example, avia may be formed through the protective layer from a top surface of theprotective layer to a top layer of the ohmic metal layer. In someimplementations, forming the via may include forming the via after, orin conjunction with, forming the protective layer. In someimplementations, a metallization layer (e.g., metallization layer 208)may be formed on the protective layer after forming the via.

Process 400 may include additional implementations, such as any singleimplementation or any combination of implementations described belowand/or in connection with one or more other processes describedelsewhere herein.

In some implementations, forming the via comprises forming the via overthe portion and such that the via is shared between the adjacent lasers.In some implementations, forming the via comprises forming the via in aninterstitial area adjacent to the two adjacent lasers. In someimplementations, forming the ohmic metal layer comprises formingadditional portions of the ohmic metal layer, wherein the additionalportions are physically separate from the portion of the ohmic metallayer. In some implementations, forming the ohmic metal layer comprisesforming the portion and the additional portions in a radially spacedconfiguration around one of the two adjacent lasers. In someimplementations, forming the via comprises forming the via radiallybetween a pair of trenches shared by the two adjacent lasers.

Although FIG. 4 shows example blocks of process 400, in someimplementations, process 400 may include additional blocks, fewerblocks, different blocks, or differently arranged blocks than thosedepicted in FIG. 4. Additionally, or alternatively, two or more of theblocks of process 400 may be performed in parallel.

The foregoing disclosure provides illustration and description, but isnot intended to be exhaustive or to limit the implementations to theprecise forms disclosed. Modifications and variations may be made inlight of the above disclosure or may be acquired from practice of theimplementations.

As used herein the term “layer” is intended to be broadly construed asone or more layers and includes layers oriented horizontally,vertically, or at other angles. Although FIGS. 1C, 2A and 2B illustrateregular grid arrangements of adjacent emitters, irregular and non-gridarrangements of adjacent emitters are equally within the scope of theembodiments described herein. Where comparison has been made betweenemitters with some specified differences, it is to be understood thatother parameters not identified (e.g., aperture sizes, oxidation trenchsizes, power and/or wavelength) would be kept the same for the purposesof that comparison.

Even though particular combinations of features are recited in theclaims and/or disclosed in the specification, these combinations are notintended to limit the disclosure of various implementations. In fact,many of these features may be combined in ways not specifically recitedin the claims and/or disclosed in the specification. Although eachdependent claim listed below may directly depend on only one claim, thedisclosure of various implementations includes each dependent claim incombination with every other claim in the claim set.

No element, act, or instruction used herein should be construed ascritical or essential unless explicitly described as such. Also, as usedherein, the articles “a” and “an” are intended to include one or moreitems, and may be used interchangeably with “one or more.” Further, asused herein, the article “the” is intended to include one or more itemsreferenced in connection with the article “the” and may be usedinterchangeably with “the one or more.” Furthermore, as used herein, theterm “set” is intended to include one or more items (e.g., relateditems, unrelated items, a combination of related and unrelated items,etc.), and may be used interchangeably with “one or more.” Where onlyone item is intended, the phrase “only one” or similar language is used.Also, as used herein, the terms “has,” “have,” “having,” or the like areintended to be open-ended terms. Further, the phrase “based on” isintended to mean “based, at least in part, on” unless explicitly statedotherwise. Also, as used herein, the term “or” is intended to beinclusive when used in a series and may be used interchangeably with“and/or,” unless explicitly stated otherwise (e.g., if used incombination with “either” or “only one of”).

1-20. (canceled)
 21. A vertical cavity surface emitting laser (VCSEL)array, comprising: a plurality of VCSELs including two adjacent VCSELs,wherein each of the two adjacent VCSELs has an independent opticalaperture; an ohmic metal layer associated with the plurality of VCSELs;and a protective layer over the ohmic metal layer, wherein theprotective layer includes a via to the ohmic metal layer, wherein thevia is shared between the two adjacent VCSELs of the plurality ofVCSELs.
 22. The VCSEL array of claim 21, wherein the via is located inan interstitial area adjacent to the two VCSELs.
 23. The VCSEL array ofclaim 21, wherein the ohmic metal layer comprises separate portions withcorresponding vias, wherein the via is one of the corresponding vias andincluded in one of the separate portions.
 24. The VCSEL array of claim23, wherein the separate portions are located in correspondinginterstitial areas between adjacent VCSELs of the plurality of VCSELs,wherein the one of the separate portions is located between the twoadjacent VCSELs.
 25. The VCSEL array of claim 21, wherein the ohmicmetal layer comprises a portion that extends between correspondingoptical apertures of the two adjacent VCSELs.
 26. The VCSEL array ofclaim 21, wherein the via is located radially between a pair of trenchesshared by the two adjacent VCSELs.
 27. The VCSEL array of claim 21,wherein a radial distance between an optical aperture of one of the twoadjacent VCSELs and the via is less than another radial distance betweenthe optical aperture and a trench between the two adjacent VCSELs. 28.An emitter array, comprising: a plurality of emitters that includes twoadjacent emitters, wherein each of the plurality of emitters has anindependent optical aperture; an ohmic metal layer associated with theplurality of emitters, wherein the ohmic metal layer includes a portionthat is shared by the two adjacent emitters; a protective layer over theohmic metal layer; and a via through the protective layer to theportion, wherein the via is shared by, and located between, the twoadjacent emitters.
 29. The emitter array of claim 28, wherein the via islocated in an interstitial area between the two adjacent emitters. 30.The emitter array of claim 28, wherein the ohmic metal layer comprisesone or more other portions that are separate from the portion, whereinthe one or more other portions are associated with corresponding vias,and wherein the one or more other portions are associated with otheremitters, of the emitter array, that are adjacent to one of the twoadjacent emitters.
 31. The emitter array of claim 30, wherein the ohmicmetal layer includes another portion associated with the one of the twoadjacent emitters, wherein the other portion electrically connects theportion and the one or more other portions to each other.
 32. Theemitter array of claim 28, wherein the via and the portion are locatedradially between two adjacent trenches between the two adjacentemitters.
 33. The emitter array of claim 28, wherein the portionelectrically connects corresponding optical apertures of the twoadjacent emitters.
 34. The emitter array of claim 28, wherein a radialdistance between an optical aperture of one of the two adjacent emittersand the via is less than a radial distance between the optical apertureand a trench between the two adjacent emitters.
 35. A method of forminga laser array, comprising: forming two adjacent lasers on or within asubstrate, wherein each of the two adjacent lasers has an independentoptical aperture; forming, in association with forming the two adjacentlasers, an ohmic metal layer including forming a portion of the ohmicmetal layer shared by, and in a location between, the two adjacentlasers; forming, in association with forming the ohmic metal layer, aprotective layer over the laser array; and forming, in association withforming the protective layer, a via through the protective layer to theohmic metal layer.
 36. The method of claim 35, wherein forming the viacomprises: forming the via over the portion and such that the via isshared between the adjacent lasers.
 37. The method of claim 35, whereinforming the via comprises: forming the via in an interstitial areaadjacent to the two adjacent lasers.
 38. The method of claim 35, whereinforming the ohmic metal layer comprises: forming additional portions ofthe ohmic metal layer, wherein the additional portions are physicallyseparate from the portion of the ohmic metal layer.
 39. The method ofclaim 38, wherein forming the ohmic metal layer comprises: forming theportion and the additional portions in a radially spaced configurationaround one of the two adjacent lasers.
 40. The method of claim 35,wherein forming the via comprises: forming the via radially between apair of trenches shared by the two adjacent lasers.